In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.

Apr 14, 2020 · This article reviews some of the processing steps associated with fabricating TSVs. A TSV is a hole in a silicon (Si) substrate that is filled with a conducting material to allow 3D electrical routing.

Apr 29, 2024 · Through-Silicon Vias are a technology to connect various die in a stacked die configuration. Through-silicon vias (TSVs) for 3D integration are superficially similar to damascene copper interconnects for integrated circuits.

Mar 5, 2015 · Through-silicon vias (TSVs) are electrical interconnects that are etched into a silicon wafer. TSVs can also be referred to as through wafer vias [1]. The primary benefit that comes from the use of TSVs is reduced interconnect length with short vertical connections through thinned silicon die.

Through-Silicon Vias (TSVs) represent an innovative technique pivotal in advancing the architecture of semiconductor devices. A TSV is essentially a high-aspect-ratio hole that passes entirely through a silicon wafer or die.

Through-silicon vias (TSVs) are electrical interconnects that are etched into a silicon wafer. TSVs can also be referred to as through wafer vias [1]. The primary benefit that comes from the use of TSVs is reduced interconnect length with short vertical connections through thinned silicon die.

Nov 24, 2020 · In this chapter, we focus on the materials and critical steps associated with fabricating TSVs and the flow process to fabricate TSV-enabled 3-D integration of silicon dies. In the following chapter, we will introduce the microstructural and reliability issues of TSVs.

Mar 8, 2016 · To address the abating performance improvements from device scaling, innovative 2.5-D and 3-D integrated circuits with vertical interconnects called through-silicon vias (TSVs) have been widely explored.

Successful and reliable 2.5D and 3D packaging relies on a simple structure to provide the required vertical connectivity needed for stacked chiplets. This structure is the through-silicon via (TSV), a vertical interconnect structure that provides …

Apr 29, 2022 · TSV，是英文Through-Silicon Via的缩写，即是穿过硅基板的垂直电互连。 如果说Wire bonding（引线键合）和Flip-Chip（倒装焊）的Bumping（凸点）提供了芯片对外部的电互连，RDL(再布线)提供了芯片内部水平方向的电互连，那么TSV则提供了硅片内部垂直方向的电互连。