The shrink small-outline package, popularly known as SSOP is a smaller type of SOIC package. It integrates SMT in packaging integrated circuits. This variant of SOIC is suitable for applications where optimum performance is crucial in IC packaging that has tightened lead pitch.

A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.

Jan 28, 2013 · In theory at least, SOIC is half the pin pitch of DIP and SSOP is half again. Thus SSOP is 0.1/4 = 0.025" or 0.635mm. Except I see many parts, from TI and Linear especially, which are SSOP (or TSSOP) with 0.65mm pin pitches.

Feb 8, 2025 · Both SOIC and SSOP are excellent IC packaging options. SOIC is larger and easier to use, while SSOP is smaller and better suited for space-constrained applications.

The SOIC is taller (1.75mm vs. 1.2mm) which is enough to make a difference in a thin product. The lead pitch is much closer (almost half) on the TSSOP- 0.65mm vs. 1.27mm, so for crude manufacturing processes the SOIC might well be preferred.

Jan 5, 2024 · Here we explained what IC packaging is and the different types of IC Packages like DIP, QFP, BGA, SOP, SMD, QFN, SOIC, and SOT.

ISO7763 is available in 16-pin WB (wide body) SOIC package which is a much bigger package offering much higher clearance/creepage and hence much higher isolation specs. Otherwise most of the electrical specifications/performances should remain the same.

Jul 21, 2017 · Yes, there are subtle differences that may or may not affect a particular design. For example, look at the specified package height from the bottom of the pins to the top of the body. Whether differences like these are "important" depend on your application. Never trust the manufacturer's package name.

The document discusses and compares different types of integrated circuit packages - SOIC, SSOP, and TSSOP. SOIC has a rectangular body with leads protruding from two sides, with each pin spaced 1.27mm apart. SSOP is a smaller variant of SOIC with a tighter lead pitch of less than 1mm. TSSOP is similar to SSOP but is even thinner.

The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. SSOP lead counts range from 8 to 64. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1.65 mm to 1.85 mm.