Jan 5, 2024 · Here we explained what IC packaging is and the different types of IC Packages like DIP, QFP, BGA, SOP, SMD, QFN, SOIC, and SOT.

A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.

Kyocera offers a wide variety of standard ceramic packages, including ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP), ceramic pin grid array packages (C-PGA), ceramic quad flat packages (C-QFP), ceramic quad flat J-leaded packages (C-QFJ) and ceramic quad flat non-leaded packages (C-QFN).

Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP packages.

Oct 24, 2023 · QFN（Quad Flat No-leadPackage，方形扁平无引脚封装），是一种无引线四方扁平封装技术。 它是具有外设终端垫以及一个用于机械和热量完整性暴露的芯片垫的无铅封装。 该封装可为正方形或长方形。 封装四侧配置有电极触点，由于无引脚，贴装占有面积比QFP小，高度比QFP低。 以下是pin脚隐藏的封装. QFN封装的特点： 重量轻，适合便携式应用。 QFN封装的小外形特点，可用于笔记本电脑、数码相机、个人数字助理（PDA）、移动电话和MP3等便携式 …

May 29, 2023 · Plastic QFN is a cost-effective package that uses glass epoxy resin as the substrate for the printed circuit board. In addition to the 1.27mm center-to-center spacing, there are also two other options: 0.65mm and 0.5mm.

Dec 13, 2022 · Quad-flat no-leads (QFN) There is another type of QFP IC, but with a different pin structure, called the QFN package. The pins of a QFN package are exposed on the bottom and sometimes on both sides and bottom.

QFN (Quad Flat No-Lead) is another commonly used IC package type. It has a flat bottom with exposed leads on the sides, making it easy to solder onto the PCB. QFN packages offer good thermal performance and a smaller footprint compared to BGA packages, making them suitable for applications where space is limited.

Flat no-leads packages such as quad-flat no-leads (QFN) [1] and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards.

Small Outline Integrated Circuit (SOIC) A surface-mount IC package with gull-wing leads extending from two sides of the package. It offers a smaller form factor compared to DIP packages and is commonly used in consumer electronics and compact devices.