To improve the thermo-mechanical reliability of lead-free packaging, a copper column interconnect with idealized solder joint shape, composed of a double-funnel shaped copper column and two lead-free solder fillets at both ends of the column, was designed to replace the high-Pb solder column interconnect in ceramic column grid array (CCGA) and ...

Thermo-mechanical behavior of the lead (Pb)-free ceramic copper column grid array (CuCGA) package under accelerated thermal cycling is characterized and compared with the conventional tin–lead (Sn–Pb) ceramic column grid array (CCGA).

May 1, 2008 · Thermo-mechanical behavior of the lead (Pb)-free ceramic copper column grid array (CuCGA) package under accelerated thermal cycling is characterized and compared with the conventional tin–lead (Sn–Pb) ceramic column grid array (CCGA).

Aug 1, 2019 · To optimize the column planting process of copper column grid array (CuCGA) package, friction plunge welding was proposed to implement the solder/Cu column interconnect assisted without mold.

The thermo mechanical behavior of the ceramic lead-free copper column grid array (CuCGA) package has bee characterized under accelerated thermal cycling using high sensitivity moire interferometry and compared with conventional ceramic tin-lead column grid arrays (CCGA).

Aug 1, 2013 · Thermo-mechanical behavior of the lead (Pb)-free ceramic copper column grid array (CuCGA) package under accelerated thermal cycling is characterized and compared with the...

In this paper, the effect of the number and the spacing for copper columns to the copper column grid array (CuCGA) interconnection structure under the condition

Aug 1, 2011 · In the CuCCA (Cu column grid array) package, the failure occur first in the solder fillet at the solder/copper column interface and the crack propagates along the periphery of the copper...

May 1, 2008 · Thermo-mechanical behavior of the lead (Pb)-free ceramic copper column grid array (CuCGA) package under accelerated thermal cycling is characterized and compared with the conventional tin–lead (Sn–Pb) ceramic column grid array (CCGA).

Dec 20, 2009 · The constitutive equation of Sn3.9Ag0.6Cu and 63Sn37Pb were established based on creep law, and the stress-strain distribution of soldered joints in copper column grid array (CuCGA) devices was analyzed under the loadings of different temperature cycles.Results indicate that no matter how the change of temperature cycle range, the maximum creep ...