We proposed an integrated non-volatile optical memory cell using novel analog linear photo-response resistance switch based on 2.5D MoS2. It enables a thermally.

We proposed an integrated non-volatile optical memory cell using novel analog linear photo-response resistance switch based on 2.5D MoS2. It enables a thermally stable and scalable …

Jan 20, 2025 · In this study, we introduce a novel multi-layer 2.5D structure designed to incorporate a double-sided cooling (DSC) packaging technology into silicon-based power …

May 20, 2022 · In this work, for the first time, we demonstrate an integrated 2.5D-MoS2-based metal-semiconductor-metal (MSM) device to function as a non-volatile optical memory at …

To solve these problems, a novel 2.5-D wire-bonding packaging was designed in this article, which combines the advantages of the simple structure of 2-D packaging and the high …

Jun 21, 2024 · In this perspective, we review the novel concept of “2.5-dimensional (2.5D) materials”, which represent new opportunities to extend the field of materials science beyond …

We proposed an integrated non-volatile optical memory cell using novel analog linear photo-response resistance switch based on 2.5D MoS<jats:sub>2</jats:sub>. It enables a thermally …

In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.

Jan 1, 2012 · This paper will discuss design consideration, manufacturability analysis, Logic/memory devices and silicon interposer interaction, and thermal management to enable …

Jun 1, 2015 · In this paper, we have outlined the benefits of adopting 2.5D TSI technology and also highlighted the current day approaches to implement this technology in Si fabrication …