On March 2, 2017, AMD released its Ryzen CPUs based on the Zen architecture, incorporating "14 nm" FinFET technology from Samsung which had erstwhile been licensed to GlobalFoundries for GlobalFoundries to build.

Intel® Core™ M Processor Die Area Scaling 42 • Dense 14 nm process features provide good die area scaling compared to 22 nm processor • 0.51x feature-neutral die area scaling • 0.63x die area scaling with added design features 82 mm2

Apr 6, 2021 · Intel has already announced that Rocket Lake will be the last desktop processor to use the 14nm node, to finally be succeeded by the 10nm Alder Lake chips later this year. Its Xeon data center...

Jan 18, 2020 · In the past five years Intel has optimized 14nm on numerous occasions with each new release adding a "+". Due to the maturity of the 14nm node Intel has been able to squeeze out more performance mainly through higher clocks.

Nov 26, 2019 · Everything about 7nm, 10nm and 14nm Fabrication Process of TSMC, Intel, and Samsung. Transistor Density & Ranking of different technology nodes.

Oct 31, 2020 · It all ranges from a new lithography size (14nm->10nm), poor yields from the silicon wafers, and also a new way of printing the circuits out on the wafers called EUV (short for E xtreme U ltra v iolet lithography).

Aug 11, 2014 · Coinciding with today’s embargo on Intel’s 14nm technology and a preview of Intel’s upcoming Broadwell architecture based Core M processor, Intel will be holding a presentation dubbed Advancing...

Mar 30, 2021 · This processor offers eight cores, sixteen threads, with a single core turbo of 5.0 GHz on the favored core, 4.9 GHz otherwise, and 4.6 GHz all-core turbo.

Mar 19, 2025 · The 14 nanometer (14 nm) lithography process is a semiconductor manufacturing process node serving as shrink from the 22 nm process. The term "14 nm" is simply a commercial name for a generation of a certain size and its technology, as opposed to gate length or half pitch.

The Processor Unit chip (PU chip) has an area of 696 mm 2 (25.3 × 27.5 mm) and consists of 6.1 billion transistors. [3] It is fabricated using GlobalFoundries' 14 nm FinFET silicon on insulator fabrication process, using 17 layers of metal and supporting speeds of 5.2 GHz, which is higher than its predecessor, the z13. [3] The PU chip has 10 …