Both WPT and WFT are performed using a wafer handler called a wafer prober. The wafer prober brings an array of microscopic needles or probes called a probe card into electrical contact with the wafer (vacuum-mounted on a wafer chuck).

Our vacuum and pressure probe stations for on-wafer measurements in a high vacuum or controlled pressure environment enable precise µ-bolometer test (un-cooled IR-FPA), MEMS characterization (inertial MEMS, resonators and RF MEMS, pressure sensors), IV/CV, RF/mmW and Opto measurements.

TH2000 is a revolutionary automatic wafer prober which combines double-sided wafer probing capability with comprehensive test resources, including electrical test, HV/HI test, warpage and surface verification, and optical inspection.

mea-surements often require that a probe (Fig. 1) be used to contact the circuit con-ductors on the substrate upon which the circuit is constructed: typically a semiconductor wafer, ceramic substrate or microwave laminate material.

systems. In addition to probers, probes and probe cards are key technologies for wafer-level reliability testing. Probes make contact between the wafer and the probe card. Within the packaged-parts equipment category, there are burn-in and life test systems; and highly accelerated stress test systems that incorporate high humidity and high ...

Scale Packaging (WLCSP) has enabled smaller and thin-ner semiconductor devices with greater functionality to be used in consumer mobile applications such as smart phones, tablets and hand held GPS track-ing devices.

FormFactor’s wafer-level probe stations, microwave and DC bias probes, and calibration tools combined with Keysight’s test instrumentation and measurement and analysis software allow you to perform comprehensive measurements on all your components.

FormFactor’s wafer-level probe station, probes, and calibration tools combined with Keysight’s test instrumentation and measurement and analysis software allow you to perform wafer-level DC parametric, IV & CV curves, and calibrated S-parameter measurements on your devices at frequencies up to 120 GHz.

Wafer-level Test and Burn-in (WLTBI) refers to the process of subjecting semiconductor devices to electrical testing and burn-in while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life failures.

With WaferPro-XP you can setup and execute automated wafer-level measurements rapidly. WaferPro-XP’s interface and workflow are optimized for Cascade Microtech semi-automated probe stations.