
FOUP - Wikipedia
FOUP (an acronym for Front Opening Unified Pod [1] or Front Opening Universal Pod [2]) is a specialized plastic carrier designed to hold silicon wafers securely and safely in a controlled …
300 mm Front Opening Unified Pods (FOUPs) | USD - Entegris
Jun 7, 2021 · Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. Industry-proven door provides equipment …
FOUP Semiconductor Wafer Handling: Everything You Need To …
Aug 17, 2023 · FOSP is a front-opening shipping box used to transfer the wafer from the wafer fabrication unit to the semiconductor manufacturing unit. On the other hand, FOUP is a front …
‘FOUP’ Wafer Handler For Semiconductor Wafers | ePAK
A wafer FOUP is a specialized container designed to safely transport 300mm silicon wafers within automated material handling systems (AMHS). FOUP is specifically designed to accommodate …
What Are FOUPs and Why Are They So Important?
Wafers are moved around fabrication facilities in specialized sealed plastic boxes known as FOUPs. These have an internal nitrogen atmosphere that keeps copper from oxidizing on the …
Inspection Systems for Foups (300mm Silicon Wafers)
Silicon wafers are generally held and transported using a Front Opening Unified Pod or Front Opening Universal Pod (FOUP), a specialized plastic enclosure specifically designed for …
FOUP - Megatech
FOUP. Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport. Industry-proven door provides equipment …
300 mm Front Opening Unified Pods (FOUPs) - Entegris
Our FOUPs (front-opening unified pods) hold 300 mm wafers safely and securely while they are transported and transferred within the fab as they move through hundreds of sophisticated …
Entegris Offers New FOUP Form-Factors for Non-Standard Wafers
Entegris is introducing new FOUP designs in order to accommodate new wafer offerings. These include: Thin-Wafer FOUPs that contain larger supports to minimize sag, plus a larger pitch …
A300 Thin Wafer FOUPs | 300 mm Front Opening Unified Pods
A300 FOUPs offer advanced wafer isolation technology in a cost-effective, 13-capacity design for 300 mm thin wafer processing.