Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradients to produce thermal stress. At temperatures where Si is still in the brittle regime, the strain may accumulate if a microcrack is pinned.

What affects resistance to brittle fracture? in silicon? Progressive time/cycle dependent fatigue mechanism could involve an alternating process of oxide formation and oxide cracking. However, the fracture toughnesses of Si and SiO. to Reaction-Layer Fatigue?

Sep 1, 2018 · Single-crystal silicon is an important material in the semiconductor and optical industries. However, being hard and brittle, a silicon wafer is vulnerable to subsurface cracks (SSCs) during grinding, which is detrimental to the performance and lifetime of a wafer product.

Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradients to produce thermal stress. At temperatures where Si is still in the brittle regime, the strain may accumulate if a microcrack is pinned.

Nov 26, 2015 · Abstract: Microcracks in silicon wafers reduce the strength of the wafers and can lead to critical failure within the solar-cell production. Both detection of the microcracks and their impact on fracture strength of the wafers are addressed within this study.

Jun 1, 2020 · In this study, a laser ultrasonic system and a crack detection algorithm were developed for noncontact silicon wafer inspection. The proposed crack detection algorithm is based on nonlinear ultrasonic modulation produced by a crack.

Nov 1, 2021 · This paper uses experimental methods to study the crack damage, and analyzes the crack morphology, crack depth and distribution law of the silicon wafer. Three-point bending method is used to measure the fracture strength.

Nov 3, 2015 · Spike annealed wafers exhibited crack patterns that started initially to run radially, but after a distance of typically 20–30 mm, turned and ran almost tangentially. Fracture did not occur on low index planes and was very irregular in direction (Fig. 1a).

Jun 21, 2023 · Silicon wafers are quite fragile and can be easily damaged if mishandled. Any sudden jolt or high vibration can cause the wafer to break or crack. Keep in mind that exposure to extreme temps or high humidity can cause the wafer to expand or contract. This is also a major cause of wafer breakage. How Can I Prevent Breakage?

Aug 1, 2013 · Dangerous cracks, which become active during heat treatment and may shatter the whole wafer, can be identified from diffraction images simply by measuring the geometrical dimensions of the...