tesa® L-tape 8698 is a translucent light curable structural bonding tape. The curing process starts upon exposure to UV or blue light (standard 365 nm or 460 nm lamps). tesa® L-tape has initial tack for easy application of the adhesive before curing.

Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.

UV Tape is adhesive tape for semiconductor process. It is suitable to protect surface of semiconductor wafer during backgrinding process, and to hold semiconductor wafer with ring frame during dicing process. It is also applicable for various workpieces such as ceramics, glass, sapphire and so on.

UV Curing / UV Release / UV Irradiation. Our high-powered UV LED technology is used to reduce tape adhesion when picking dies after wafer singulation, or for UV treatment of various kinds of materials. Fully engineered, designed and manufactured by POWATEC in Switzerland.

The Adwill E series of UV curable back grinding tape prevents damage on wafer surface during back grinding and contamination caused by grinding fluid and/or debris. Adhesion of the tapes can be substantially decreased with UV irradiation, …

In this category (A2), we have UV cure wafer backside grinding tapes required in semiconductor manufacturing process. They are available respectively for low and high bump wafer grinding.

Silicone Wafer Back Grinding Tape. This UV tape(FON 10127) is a cutting-edge solution designed for back grinding and silicon wafer processing. Its advanced UV-curable adhesive allows for stress relaxation, ensuring minimal damage during grinding.

Complete control of tape adhesion. The Lintec Adwill series includes UV curable dicing tapes, high performance back grinding tapes, dicing die bonding tapes required for semiconductor packaging, and backside coating tapes.

Special Heat-Resistant Dicing Tape is UV curable type, and even if it is heated up to 150 °C in your process for 1 hour, it can easily be peeled from the work after UV irradiation, and there is little generating of an adhesive residue. There is no …

UV curable, heat-resistant dicing tape is a specialized adhesive tape used in semiconductor manufacturing to secure wafers during the dicing process. This type of tape is designed to withstand high temperatures, typically up to 150°C, without losing its adhesive properties or leaving significant residue after UV irradiation 1 .