Materion developed its unique Visi-Lid™ covers for customers who require a solder packaging lid with a window attachment for their photonic package. A wide array of advanced technologies utilize solder lids that require transmittance of electromagnetic radiation.

Solder Seal Lids, also known as Combo Lids TM, have long been a standard of the semiconductor industry for high reliability and hermetic package sealing. Standard lids are produced with Alloy 42 or Kovar, are plated with nickel and gold, and feature a gold tin eutectic frame already attached to the lid.

Ceramic Solder Seal lids are a variation of the metal Combo Lid™ which has been a standard in the semiconductor industry for decades. Our variation of the combo lid features a flat 90% Alumina ceramic cover with a metalized sealing surface along the outer edge.

Coining Cover Assemblies (package lids) offer many advantages for the hermetic sealing process of electronic packages over techniques using separate solder preforms and covers. The base material is electroplated with nickel for solderability and to prevent corrosion in the future.

Materion offers microelectronic packaging materials, including high-reliability lid covers for hermetic packaging, ceramic & RF packages, and braze & solder alloys.

Solder Preforms: available in various shapes and sizes and for forms including wire, strips, sheet, ribbon, preforms, frames, and more. Multiple designs and materials can be customized for specific applications.

SURON's lids can be designed for a variety of sealing methods, such as seam welding, laser welding, low temperature soldering or brazing. SURON provides a comprehensive range of lids for hermetic packaging, for both glass to metal sealing …

Tack-welding the solder preform to the lid conveniently aligns the solder to the perimeter of the lid, simplifying handling and reducing part count. Therefore, Hermetic Combo-Lid™ covers offer a best-cost solution. BENEFITS OF COMBO-LIDS™ Corrosion Resistance; Moisture resistance; Solder preform already attached for ease of assembly

AuSn Solder Seal Lids. The AuSn solder seal lid consists of a lid with a gold-tin solder preform tack-welded on it. The product has been widely used in hermetic packaging of microwave RF modules, FPGA, MEMS devices and optoelectronics.

Stepped lids offer the ideal solution for sealing hermetic packages using a seam welding process. They may also be specified where laser welding is employed. We can offer both stamped and etched versions to ensure an ideal profile with optimum results.