
SO 8 vs SOIC 8 Chip – What are the Differences Between Them?
The main difference between SOIC8 and SO8 manufacturing is the width of the leads from the IC itself. SO8 has a little larger footprint per pin than SOIC8, but with similar pin gap space per row, they fit the same board configuration. SOIC stands for surface mount integrated circuit package.
SO-8 footprint & symbol by Essentra | SnapMagic Search
Download schematic symbols, PCB footprints, pinout & datasheets for the SO-8 by Essentra. IC GATE DRVR HALF-BRIDGE DSO8. Exports to OrCAD, Allegro, Altium, PADS, Eagle, KiCad, Diptrace & Pulsonix.
iC-Haus IC-WKM SO8: Symbol, Footprint, 3D STEP Model | Ultra …
Download CAD models for the iC-Haus IC-WKM SO8. Available in over 22 CAD formats including: Altium, Eagle, OrCAD, KiCAD, PADS, and more.
SOIC8 vs SO8 vs DSO8? - Page 1 - EEVblog
May 25, 2023 · The question was not actually completely weird, there's a number of variations of so-called "SO8" packages, and unless this is an IC you already are familiar with, you better check in the datasheets for the exact packages, using the exact part reference.
SO-8 Datasheet(PDF) - STMicroelectronics
Description: 8-LEAD SMALL OUTLINE PACKAGE. Manufacturer: STMicroelectronics.
iC-WK Series - iC-Haus GmbH
The iC-WK/L device is a driver for laser diodes in continuous wave operation which requires only four external components. The wide power supply range of 2.4 to 6 V and the integrated reverse battery protection allow for battery operation with a minimum of two cells.
SO-8 vs. SOIC-8 Chip: What’s the Difference? - ElectronicsHacks
Sep 26, 2023 · The SO-8 package is a small outline 8 (SO-8) integrated circuit (IC) package that operates at up to 150 volts. It’s used in a variety of applications, from automotive to consumer electronics. The pins are arranged in two rows of four pins each and it can typically be soldered by hand or using automated processes.
SO8 - Toshiba Electronic Devices & Storage Corporation
Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the dimensions and packing method for Toshiba Semiconductor's SO8 package.
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so8 3d models - STLFinder
SO8 IC Package Specifications Size and Shape - A Rectangular Form Factor Measuring 4.8 Millimeters in Length by 3.9 Millimeters in Width Modeling Use Only - Not Suitable for Printing.