Silver Adhesive Pastes for Die-bonding - TANAKA Precious Metals
Conductive adhesives for die bonding are used with Si for power devices and SiC and GaN next-generation semiconductors. Our lineup includes hybrid types that allow a balance of high thermal conductivity and high reliability and sintering types with …
Bonding Sintered Stone Surfaces: What to Consider | Tenax USA
For repairs of sintered stone, having an adhesive that bonds the surfaces strongly enough to last is very important. Adhesives are at times made for use on specific materials. So, in order to get a good bond on sintered stone it is wise to choose a glue that is made for Sintered Stone.
Pastes for Die Bonding - sumibe.co.jp
Sumitomo Bakelite Co., Ltd. supplies not only conventional packaging materials but also materials proactively developed for BGAs, CSPs, LED and other advanced packages. The CRM series are one-component type of die attach pastes with high reliability for …
ATROX® 800HT2V | MacDermid Alpha
ATROX 800HT2V is a thermosetting conductive die attach adhesive with very high thermal conductivity designed for high power semiconductor packages. ATROX 800HT2V has low resin bleed out and low condensable organics which ensure excellent package reliability. What do you need solved? Let our experts find your solution.
Die Attach - MacDermid Alpha
The ATROX 800HT Series is a thermosetting conductive die attach adhesive with high thermal conductivity (>100 W/m-K) designed for high power semiconductors and exposed pad semiconductor packages.
facilitates silver sintering at relatively low temperature compared with sintering silver and enables up to 250W/mK thermal conductivity without pressure during cure.
Heraeus Electronics | Sinter Materials
The Heraeus Electronics mAgic® series sinter material is suitable for power applications on substrates, baseplates or heatsinks (pressure sintering) as well as for lead frame packages (non-pressure sintering).
-To propose hybrid sintering dieattach material with good performance and robust process. Approach-To design and formulate silver fine filler, resin system and solvent for hybrid sinter material. -To evaluate die shear value, thermal conductivity, …
Sintering and Semi Sintering Pastes | Die Attach Materials - Caplinq
Semi-sintering vs. sintering die attach pastes: Choose the right option for your application. Explore benefits, limitations, and suitability for semiconductor packages.
Recently, a hybrid technology that marries the high thermal performance of pure silver sintering materials with the reliability of epoxy-based die attach pastes has been developed and is a promising solution to address these challenges.