JEDEC PACKAGE REFERENCE IS MO-203 VARIATION AB 2.8 BSC 0.47 MAX 0.65 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.8 REF 1.00 REF INDEX AREA (NOTE 6) 0.10 – 0.18 (NOTE 3) 0.26 – 0.46 GAUGE PLANE 0.15 BSC 0.10 – 0.40. Title: Package Drawing - SC70 6-Lead Plastic 05-08-1638 Rev B Author: Linear Technology Corporation Keywords ...

plastic, surface-mounted package; 3 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body

Mar 16, 2006 · plastic, surface-mounted package; 3 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body

Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two long sides. Due to their low cost and low profile, SOT's are widely used in consumer electronics. The SOT …

5-Lead Plastic Small Outline Transistor (LT) [SC70] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

marking is for package orientation reference only. 5. foot length measured at intercept point between. 3. dimensions are exclusive of mold flash & metal burr. ... 4l, sc70. package outline, 1. 1. h. 21-0098. kai liu. title: package outline, 4l, sc70 …

Wave soldering footprint for SC-70 (SOT323) Limited warranty and liability — Information in this document is believed to be accurate and reliable.

SC-70 package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.

Dimensioning and tolerance per ASME Y14.5M-1994. Package conforms to EIAJ SC70 and JEDEC MO203AB. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. Footlength L measured at reference to gauge plane. “N” is the number of terminal positions.

a 3-Lead Thin Shrink Small Outline Transistor Package [SC70] (KS-3) Dimensions shown in millimeters ALL DIMENSIONS COMPLIANT WITH EIAJ SC70 072809-A 0.40 0.25 0.10 MAX 1.00 0.80 1.10 0.80 0.40 0.10 0.26 0.10 0.30 0.20 0.10