Feb 23, 2022 · Figure 62 Reference Liquid Cooling Design for UBB. 1: Universal Base Board; 2: Host Interface Board; 3: Power Distribution Board; 4: Liquid Cooling Module. The cooling components and OAMs in the figure are just for concept

Welcome to the Open Accelerator Infrastructure (OAI) subgroup. OAI group is mainly working on define the common infrastructure specification for various accelerator solutions, such as common form factor, universal baseboard etc.

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Sep 27, 2019 · Inspur unveiled a number of new technologies at the Open Compute Project (OCP) Regional Summit in Amsterdam this week. Perhaps the most impactful of these over the next 24 months is the Open Accelerator Module (OAM) Universal Baseboard (UBB.) We are going to use OAM UBB to keep that shorter.

• OAM is an Open Accelerator Module supporting multiple suppliers • A multi-OAM, Universal Baseboard (UBB) supporting various Interconnect Topologies • Tray for sliding a collection of OAMs (different UBBs) • System Chassis, Power, and Cooling (different Trays) • System- and Rack-level Management (DC-SCM)

adhering to an agreed-upon set of hardware design standards, such as Universal Baseboard (UBB), OCP Accelerator Modules (OAM), and PCI-E and platform-specific interfaces, IT administrators can choose the GPU architecture best suited for their HPC or AI workloads.

Open Accelerator Modules (OAMs) answer the call for optimized performance and agile response with adaptable hardware solutions that support demanding applications and extend the lifecycle of existing infrastructure, ultimately reducing the total cost of ownership.

• OAI-UBB provides Host interface and native Expansion capabilities for eight OAMs • OAI-Tray provides mechanical support to adapt various UBBs in 19” and 21” Chassis • Modular power distribution allows 12V, 48V, and AC distribution to the Chassis

Open Accelerator Infrastructure – Universal Baseboard Design Specification v1.0 1 Open Accelerator Infrastructure --- Universal Baseboard Design Specification

本文档详细介绍了Open Compute Project (OCP) Open Accelerator Infrastructure (OAI) 项目的路线图，重点阐述了OAM v2.0、UBB v2.0以及EXP v1.0的规格和设计要求。 规格说明：详细描述了OAM v2.0的技术规格，包括硬件接口、电气特性、机械尺寸等。 设计要求：列出了实现OAM v2.0模块所需满足的设计标准和性能指标。 规格说明：介绍了UBB v2.0的架构设计，包括模块间的通信协议、数据传输速率等。 设计要求：提供了UBB v2.0模块的设计指南，确保模块的兼容 …