Aug 5, 2024 · In this Professional Development Series session, you'll learn about key aspects of High Bandwidth Memory (HBM): What is HBM, a short history of HBM, why is HBM important right now, how Large Language Models (LLMs) and Generative AI are driving demand for HBM technology, comparison of HBM with other popular memory …

Everything you need for PCB testing: Fast and simple mechanical durability and reliability testing based on strain measurement on printed circuit boards.

HBM provide PCB testing services to detect any failures. PCB Test Kit Everything you need for PCB testing: Fast and simple mechanical durability and reliability testing based on strain measurement on printed circuit boards.

Integrating High Bandwidth Memory (HBM) chips into PCBs presents a unique set of engineering challenges due to their high-performance requirements. From managing heat dissipation to ensuring seamless data transfer, addressing these challenges is critical for optimizing performance and reliability.

Aug 16, 2023 · HBM-PIM (High Bandwidth Memory — Processing-in-Memory) is a promising PIM hardware incorporating PIM cores inside memory banks. The host CPU can access the HBM-PIM in PIM or normal...

May 2, 2023 · As the fourth generation of HBM, HBM3 is approximately 78% faster than its predecessor, HBM2E. With such capabilities, HBM products can be deployed in high-performance data centers and applied to machine learning, supercomputers, artificial intelligence systems, and other advanced technologies.

Oct 12, 2021 · High-Bandwidth Memory (HBM) interfaces prevent bottlenecks in online games, AI applications, and more; we explore design challenges and IP solutions for HBM3.

Mar 13, 2023 · HBM is critical for high-end graphic cards, networking, AI, and datacenter SoCs; HBM2E provides 2x more capacity for 50% more speed over HBM2; Synopsys provides end-to-end protocol verification solution for HBM2E

Sep 28, 2023 · HBM is a game-changer in the memory technology landscape, providing a remarkable boost in both bandwidth and energy efficiency. This makes it a perfect fit for applications demanding rapid and efficient data processing.

Oct 17, 2022 · At CadenceLIVE China 2022, AI-startup, Enflame Technology, revealed how their engineering teams have overcome silicon interposer design challenges connecting over 1700 signals between an HBM memory stack and their own priority AI-based chip design across a silicon substrate.