Room-temperature bonding of vertical-cavity surface-emitting laser chips on Si substrates using Au microbumps in ambient air

Surface activated flip-chip bonding tests were conducted using GaAs VCSEL chips with Au electrodes and Si substrates with Au electrodes. The size of the VCSEL chip is 300

Eiji HIGURASHI, Professor | Cited by 2,847 | of Tohoku University, Sendai (Tohokudai) | Read 320 publications | Contact Eiji HIGURASHI

Sep 20, 2013 · “There were always metal chips on the soles of his shoes,” from walking in the casting and machining plants. Eiji Toyoda led from the front. His message to leaders within Toyota: I want you to use your own heads. And I want you actively to train your people on how to think for themselves.

Mar 25, 2025 · 有限要素法解析技術を活用し，任意の工具形状に対して振動が生じた際に逃げ面に作用するプロセスダンピング力を，シミュレーション上で取り出す技術を開発した．有限要素法解析では，2次元切削に基づき材料の弾塑性変形挙動と熱・ひずみ速度依存性を考慮した所望の切削シミュレーションを実施した．解析において，不連続なテクスチャ形状がシミュレーションの不安定化を引き起こす問題が生じたが，これを回避する手法を確立し，テクスチャの …

This research presents a novel approach to controlling chip flow in turning operations to prevent jamming, particularly for highly ductile materials. The proposed method employs guide grooves and a guide tunnel on the rake face of cutting tools to continuously guide chips toward a disposal or chip-pulling device, enhancing machining efficiency.

Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

High-density memory chips, however, are vulnerable to soft errors caused by... This paper proposes a joint coding with three functions: source coding, channel coding, and public-key encryption. A...