
Dimple: Microvia Dimple in Blind and Buried Via HDI PCB
With its assistance, the copper reduction thickness can be controlled as thin as 2μm per polishing time no matter rigid or flex circuits. Dimple stands for via fill quality, represents the difference between deposited copper thickness on initial copper &within a via (/microvia).
The 80% coverage dimple ceramic Flex-Lag was installed in 2001. The lagging boasted the following benefits: • The moulded ceramic dimples grip the belt’s underside, for positive traction and no slippage • 80% tile coverage features the highest coefficient of friction available in lagging materials – two to
For the DAI package, the planar dimple copper flex (source) is more robust and does not need molding protection. The flex serves as a good heat path that exchanges heat with the environment through convection. Obviously, using the DAI substantially improves the heat-dissipation capability because double-sided cooling is enabled.
Geo-Mat+ Drainage Board - Mar-flex Waterproofing & Building Products
Whether it is employed as a dampproofing drainage roll or as part of a waterproofing system in conjunction with one of Mar-flex’s superior waterproofing membranes, Geo-Mat+ sets the standard for protection. Advantages: • Resistance to hydrostatic pressure • High dimples provide ample drainage capacity
80% Ceramic Dimple Flex-Lag - flexco.com
The moulded ceramic dimples grip the belt’s underside, for positive traction and no slippage 80% tile coverage features the highest coefficient of friction available in lagging materials – two to three times the friction of rubber, resulting in lower energy costs
Technology Strengths - MFS
Unique dimple mating, with high reliability corrosion resistant for pressure contact (interconnection technology) Integrated various design and thickness heater flex, plastic and metal on flexible printed circuit
FPC/FPCA - I-Tronics
Single-sided Flex. Consists of single conductor layer on a flexible dielectric film; Ideal for dynamic flexing application; Can deliver in tape n reel, >1m length
In this subthrust, the design of the DAI for power semiconductor devices and modules was first presented. Then, the fabrication process of the DAI was developed, including UBM processing, dimple flex interconnect stamping, die-attach, dimple area …
May 7, 2021 · In the mid-1980s Flexco introduced 80% ceramic dimple lagging to the market . This highly-engineered product added longevity to the lagging, but also added benefits to the conveyor design by providing a greater coefficient of
Flex-Lag® Weld-On™ Pulley Lagging
Flex-Lag ® Weld-On ™ Pulley Lagging features a patented gear-tooth design. This eliminates the wide gutters present in conventional weld-on lagging products and also helps minimize problems associated with vibration, cleaner chatter, and overall belt cleaner compatibility.