Feb 25, 2021 · Just as an engine is mounted on a vehicle to supply power, die bonding electrically connects a chip and the outside, by bonding a semiconductor chip onto a lead frame or a …

Die bonder, also called SMT mounter, the most critical and core device in the die attach link of chip packaging and testing. Grab the chip from the cut wafer, place it on the die flag …

The new Palomar 3880-II die bonder is based on Palomar’s proven die bonder design but includes options to even further maximize productivity, reduce programming time by up to …

Leading optoelectronic and semiconductor packaging companies require fully automated, high precision die bonders with in-situ capabilities, such as epoxy die attach, eutectic die bonding, …

Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ …

A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The new Palomar 3880-II Die Bonder is based on Palomar’s proven die bonder …

The FC300 High Precision Flip Chip / Die Bonder is a high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated …

Jan 27, 2025 · A die bonder is a machine used during the back-end phase of the semiconductor fabrication process to complete semiconductor devices. The rapid development of electric …

As sub BU of HJS group, this company’s main business is high-precision die bonder, die sorter and related customized equipment in the optical communication and semiconductor industry. …

Die bonding, often regarded as the heartbeat of the semiconductor assembly process, finds its true innovation in the technologically superior machines provided by 4JMSolutions. This …