May 7, 2020 · A CMP simulation-driven dummy fill optimization method for achieving strong planarity requirements in advanced technology nodes was developed and tested using Calibre CMPAnalyzer, Calibre CMP ModelBuilder and Calibre YieldEnhancer SmartFill tools.

CMP hotspot analysis looks for areas of the design that have a higher than average probability of experiencing defects due to chemical-mechanical polishing (CMP).

New DFM-compliance capabilities include Lithography Compliance Checking (LCC), Critical Area Analysis (CAA), and CMP (Chemical Mechanical Polishing) modeling, simulation and extraction -- all integrated with design implementation.

Cadence DFM Services leverages knowledge from across the Cadence engineering, foundry, and applications teams. The result is a robust, timely service that enables customers to complete signoff litho and CMP analyses on advanced node designs.

Quality of Chemical Mechanical Polishing (CMP) process depends up on the planarity of the surface area. Sometimes due to various defects like oxide loss, dishing, erosion and total copper loss, we may not be able to maintain planarity, which results in manufacturing defects.

Design for manufacturability (DFM) targets design analysis, modeling, optimization and automation to enable manufacture of working chips, and improve chip performance and reliability, in the face of mounting challenges (variability, leakage, etc.) in semiconductor manufacturing.

Jun 12, 2024 · DFM focuses on optimizing designs to meet manufacturing constraints, while CMP ensures planar surfaces essential for multi-layer ICs. These checks help reduce defects, improve yield, and lower...

Apr 4, 2011 · We demonstrate how to apply a characterized 32nm CMP physical model to run block level simulation with little or no context information. The block level simulation methodology allows designers to check block robustness against any possible surrounding environments in which the block may be placed.

In this paper, we use artificial neural networks and Group Method of Data Handling (GMDH) polynomial networks to build CMP models based on real silicon data, and compare and analyze the two approaches. Conferences > 2023 International Symposium ...

To address these, a multi-scale (feature/die/wafer) CMP modeling framework is being developed for enabling Design for Manufacturing (DfM) and Manufacturing for Design (MfD). Topographic evolution has been studied for Shallow Trench Isolation CMP …