Jadeshay 130 Pcs BGA Stencils Kit, 6 Sizes Steel Reballing Rework Net Direct Heat Templates for Laptop, Desktop Motherboards, GPUs

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BGA stencils are critical tools for making the reballing process run smoother. They are designed to simplify the array device placement to save you as much as 50% of the time you would otherwise spend reworking your BGA. Below, we've provided more information about how to select and use the right BGA reballing stencil for your unique needs.

StencilQuik are flexible solder paste stencils that remain in place on the site location becoming an integral part of the prototype printed circuit board assembly. They allow you to simplify area array device placement/replacement saving 50% or more …

These BGA stencils are laser cut from high quality, anti-static polyimide film with a residue-free high temperature adhesive backing. The StencilQuik™ apertures correspond to the land patterns on the PCB and define those portions of the PCB which are to have paste or paste flux applied.

The Practical BGA Reballing Kit features patented stencils and holder to manually rework BGA components to original condition. Restore costly BGAs to original condition using hot air rework stations or tools. Simply squeegee on flux, pour on solder balls and rework with hot air!

We have an answer to your frustrations--- the StencilQuick™ BGA Rework Stencils. This breakthrough method allows you to simplify area array device placement/replacement saving 50% or more of the time required to rework BGAs or CSPs.