Interesting Engineering on MSN22h
‘Worse than atomic bomb’: Panic grows over Japan lab handling deadliest viruses
Japan's long wait of 15 years for a BSL-4 lab to study deadly viruses got longer after public opposition to the setup at ...
Interesting Engineering on MSN1h
Palm-sized resilient robot fleet could help in rescue ops, landmine clearance
Markus Nemitz and his team at Tufts University have developed soft-jointed robots using 3D printing, realizing a long-term research goal.
Machine Design16h
IO-Link Masters: Enabling Sensors and Devices to Communicate Through Software
Link, a manufacturer-independent digital communication protocol/interface, while introducing a software solution.
Semiconductor Packaging News6h
Effect of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling
This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...