C&G Hi Tech announced it has succeeded in large-area (510*515mm) thin-film formation with a thickness of over 7N/cm and a ...

Taiwan-based makers have established an alliance targeting the supply of glass substrates, potentially a game changer for semiconductor packaging. Printed circuit board (PCB) and IC substrate ...

Intel has announced the industry's first Glass Core Substrate (GCS ... list for fiscal year 2023. Nan Ya PCB, the second-largest provider of IC substrates, re-entered the supply chain after ...

Plus, check out the blogs featured in the latest Automotive, Security & Pervasive Computing, Test, Measurement & Analytics, ...

Electronics also need an integrated circuit substrate and a printed ... metal or glass — a package. Once created, this package is connected to a PCB and placed into an electronic device.

ASU's new R&D facility is a key component of America's plan to bolster semiconductors and high-tech manufacturing.

FR4 is FR4, right? For a lot of PCB designs, the answer is yes — the particular characteristics of the substrate material don ...

According to the industry on the 20th, domestic corporations including Samsung Electronics and Samsung Electro-Mechanics, along with SKC and LG Innotek, are developing glass substrate technologies ...

Advanced packaging technologies and high-bandwidth memory (HBM) have fueled a surge in global chip demand. Beneath the ...

Achieving "glass skin" is having a smooth, glowing complexion. This beauty trend boasts skin so luminous it resembles the clarity of glass. Originating in South Korea, glass skin has become the ...