IC 1396 is faintly visible to the naked eye from a truly dark site, and it is large — more than a degree across. It is the scene of a stellar nursery, as is the case with emission nebulae, ...

Abdul Rauf Azhar, IC-814 Hijacking Mastermind, Killed In Op Sindoor: BJP Abdul Rauf Azhar, a most-wanted terrorist, was involved in the hijack of Indian Airlines IC 814 in Kandahar in 1999 ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC progress and issues, photonics, and tradeoffs with different interposers and bridge technologies, with Michael Kelly, vice ...

The evolution of IC packaging. Traditionally, multi-chip module (MCM) flip chip ball grid array (FCBGA) packaging has been used for heterogeneous interfaces of multi-chips on laminate substrates.

Daeduck Electronics' large body FCBGA substrate can also be applied to CPUs, GPUs, and 2.5D packages known as CoWoS (Chip on Wafer on Substrate) packaging used in AI (artificial intelligence) servers.

Daeduck Electronics' large body FCBGA substrate is a state-of-the-art substrate with a size of 100mm x 100mm, with 20 or more layers, and is applied to high-performance computing (HPC) chips ...

The intelligence community (IC) published its first-ever open-source intelligence (OSINT) strategy in March. It is a big-picture, priority setting document—an essential, basic step to re-launch OSINT ...

Miura’s IC-602 irons will be available online starting April 16 for $350 per head. Want to try them out first? Head over to True Spec Golf for a comprehensive IC-602 fitting.