Gov. Henry McMaster has vetoed three bills in 2025 and some notable line items from next year’s state budget following the conclusion of the South Carolina Legislature’s ...

Media reports from Asia indicate that MediaTek has recently secured substantial FCBGA packaging capacity, suggesting the two companies are preparing to unveil PCs with soldered processors.

Meanwhile, Mediatek is said to have booked plenty of packaging capacity. The intended use is not certain, but the FCBGA technology (Flip Chip Ball Grid Array) suggests solderable notebook ...

All machines are manufactured, assembled, and tested in Taiwan, delivering high-performance solutions for advanced packaging platforms such as FCBGA, FCCSP, Fan-Out, and Fan-In (Wafer Level Packaging) ...

The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...

Daeduck Electronics announced the successful development of a large body FCBGA (Flip-chip Ball Grid Array) substrate for AI servers and data centers. FCBGA is a high-density semiconductor substrate ...

GYEONGGI-DO, SOUTH KOREA -- Daeduck Electronics announced the successful development of a large body FCBGA substrate for AI servers and data centers. FCBGA (Flip-chip Ball Grid Array) is a ...

SAN JOSE, Calif., June 24, 2024--(BUSINESS WIRE)--Daeduck Electronics announced the successful development of a large body FCBGA substrate for AI servers and data centers. Established in 1965 ...

The Core Ultra 9 185H is designed for the Socket 2049 FCBGA and operates with a Thermal Design Power (TDP) of 45W. Notably, the Ultra 9 series is the only one in the Meteor Lake lineup utilizing a ...