While design engineers contemplate the power, performance and area calculation of an SoC design, their verification ...

Intel has scrapped product launches and slowed its process technology roadmap as it embarks on a path toward a rebound that ...

EnSilica announces that it has been awarded funding from the UK Space Agency under its Connectivity in Low-Earth Orbit ...

EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes ...

Industry leaders join team of experts including Jim Keller, Sailesh Kumar and Stan Reiss to propel innovation in the new era of high-performance system-of-chiplets design ...

Celestial AI™, creator of the Photonic Fabric™ optical interconnect technology platform, today announced the appointment of Lip-Bu Tan to the Board of Directors.

PIX, the leader in innovative image processing and compression technologies, is proud to announce the integration of its ...

Quadric today announced that it is establishing a subsidiary, Quadric KK, in Tokyo, Japan, with industry veteran Jan Goodsell as President.

Ceva today announced the appointment of Amir Faintuch, a seasoned technology executive, to its Board of Directors as an ...

Codasip GmbH and RED Semiconductor International Ltd have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced AI acceleration technologies.

This office represents a key milestone for Mixel as its first in Asia. It will enable Mixel to expand its engineering talent, ...

PIX, the pioneering provider of lightweight compression solutions, is thrilled to continue its collaboration with Nextera ...