Apple's next-generation M5 chip will debut in the MacBook Pro in the fall, followed by the iPad Pro sometime in the first ...

Apple's iPhone 16 Pro Max has been comprehensively beaten by the Samsung Galaxy S25 Ultra in a real world app speed test ...

flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin ...

Asus India has announced the launch of its 2025 lineup of AI laptops including Vivobook 14 Flip, Gaming V16, and many more.

Its snap cure at lower temperatures enhances production efficiency, making it ideal for memory cards, chip carriers, and hybrid circuits. UF 120LA’s superior thermal resistance and mechanical ...

I know that the Samsung Galaxy S25 Ultra is a brilliant phone, but it's not the phone for me. Find out more in our Galaxy S25 ...

More recent (but still historical) larger packages such as ball grid arrays (BGAs) have relied on a substrate that typically holds a flip-chip die. That substrate ... bumps to not join to the other ...

AI-driven automation, tighter design-test collaboration, and evolving BiST techniques are redefining DFT strategies.

Abstract: The formation of small voids can occur in solder-based flip chip joints during the assembly process, and a concern for certain applications that involve high electrical and thermal flux ...

In honor of Presidents' Day weekend, retailers across the board are slashing prices on hot tickets items like TVs, laptops, ...