Effective plasmonic characterization in 3D nanostructures is key to achieving reliable performance, integrating fabrication ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

In DRAM chips, besides access transistors, peripheral transistors must meet stringent requirements which preclude a ...

Ukrainian specialists have recorded several significant changes in the Russian-modified versions of Iran's Shahed-136 strike ...

Researchers have developed a 28×28 synaptic device array that mimics the human visual system, achieving 96.5% digit ...

Two heads are better than one, as the saying goes, and sometimes two instruments, ingeniously recombined, can accomplish ...

Each cell of the human body contains two meters of DNA. The whole secret lies in the intricate three-dimensional arrangement that allows DNA strands to be efficiently organized and compacted within ...

A hybrid microscope allows scientists to simultaneously image the full 3D orientation and position of an ensemble of molecules, such as labeled proteins inside cells. The microscope combines polarized ...

Researchers have developed a high-resolution embedded 3D-printing technique that enables the fabrication of ultra-fine fibers ...

Safety critical components for aircraft and Formula 1 racing cars could one day be 3D printed via a new technique that substantially reduces imperfections in the manufacturing process.

We are used to stories about reverse engineering integrated circuits, in these pages. Some fascinating exposés of classic chips have been produced by people such as the ever-hard-working [Ken ...

Rapid, localized heat management is essential for electronic devices and could have applications ranging from wearable ...