The adapter tops have landing pads that can be designed to accept any device on any pitch and easily settle into fine pitch footprints including Thin-Shrink Small Outline Packages (TSSOP) and Quad ...

The adapters have tops with BGA landing pads on a 0.40 mm pitch and bottoms fitted with BGA balls on a 1.00 mm pitch. Open space around the adapter tops provides space for further components to be ...

The line of BGA Switch-A-Pitch Adapters now includes models with tops where the BGA landing pads are on a 0.40-mm pitch and adapter bottoms are populated with BGA balls on a 1.27-mm pitch.