Surging adoption of AI, next-generation technologies is driving semiconductor makers to expand 7nm and more advanced ...

There are numerous reasons why it’s so hard to produce high-yielding chips at the 300mm wafer edge, including wafer uniformity, process variation, and multi-layer effects such as film stress.

Dialing in nanosecond pulses to cleanly cut silicon wafers. Focused on edge quality, thermal effects, and process repeatability.

Synova S.A., the Swiss-based manufacturer of state-of-the-art water jet laser systems, is delighted to share its advances in wafer edge profiling for silicon carbide (SiC) wafers. The LCS 305 5 ...

A laboratory setup where quantum material samples are placed on a slide under a microscope, revealing their distinctive structure. An illu ...

Roll-off in the wafer edge profile can impact wafer bonding quality. Long wet etch processes in 3D NAND manufacturing may result in severe substrate damage at the edge.

Synova's Laser MicroJet Ò (LMJ) technology achieves outstanding results in SiC wafer edge beveling and profiling and is set to revolutionize the semiconductor industry. DUILLIER, Switzerland ...