ORLANDO, Fla., August 09, 2024--Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and chipping during wafer ...

Additionally, a quick assessment indicates that laser ablation should not encounter issues when dicing 30 µm saw street wafers. Comparing actual dice produced by blade dicing and laser ablation, laser ...

In summary, a narrower kerf width results in more chips per wafer, ... Fonon’s FWLD technology allows for the production of multiple size dies on the same wafer and the dicing of complex shapes.

Wafer Stealth Dicing / Motion Control for Laser Based Semiconductor Wafer Dicing. 5-DOF Stage for Wafer Stealth Dicing / Semiconductor Wafer Dicing. Video Credit: PI (Physik Instrumente) LP ...

Rudolph and DISCO partner to optimize the wafer saw process through post-saw inspection, real-time monitoring and feedback of dicing tools and wafer-t Rudolph Technologies and DISCO Corporation ...

New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate ...

How Does Fonon BlackStar Maximize Wafer Dicing Yield? Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and ...

ORLANDO, Fla., March 29, 2024--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...