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Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...
Lam Research Introduces World's First Bevel Deposition Solution to Increase Yield in Chip Production
Roll-off in the wafer edge profile can impact wafer bonding ... Coronus DX deposits a thin dielectric layer of protection on the bevel. This precise and tunable deposition helps resolve these ...
Unlike traditional round wafers, ACM’s innovative design ensures a precise bevel removal process that remains confined to the bevel region, even on warped panels. This advancement is vital for ...
About the Ultra C b Backside Clean and Bevel Etch Tool ACM’s Ultra C b backside cleaning portfolio supports 200mm and 300mm wafers, pivotal in IC wafer manufacturing, wafer-level packaging ...
Lam Research Introduces World's First Bevel Deposition Solution to Increase Yield in Chip Production
Roll-off in the wafer edge profile can impact wafer bonding quality ... When those defects cannot be etched away, Coronus DX deposits a thin dielectric layer of protection on the bevel. This precise ...
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