Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

Soitec will supply PSMC 300mm substrates incorporating Transistor Layer Transfer (TLT) ready, to support a new demo of ...

The "Global 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV, 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics ...

Under the collaboration, Soitec will supply PSMC 300mm substrates incorporating a release layer, Transistor Layer Transfer (TLT) ready, to support a new demonstration of advanced 3D chip stacking at ...