Add ground stitching vias wherever the natural via density is low. So far, we've looked at PCB basics and high-speed layout issues. Let's continue with the high-speed thread, diff-pairs, and ...

Figure 2. Recommended 4- or 6- layer stack for a receiver PCB design Routing the high-speed TMDS traces on the top layer avoids the use of vias (and the introduction of their inductances) and allows ...

It also should be 0.062 in. thick with standard FR-4 and a copper foil weight of 1 oz. Additional layers, extra thick or thin boards, vias-in-pad, back-filled vias (non-conductive preferred due to ...

PCB assemblers don't like it. But with some designs, if done properly, there can be a number of compelling reasons for putting vias directly in the SMT pads for BGA and QFN packaged components: ...

Contacts Mentor Graphics Leslie Van Grove, 720-494-1014 [email protected] or Weber Shandwick Emily Taylor, 503-552-3733 [email protected] ...