Rather than using numerous through-holes in a multi-layer PCB, designers have found that using blind and buried vias can tremendously increase routing density. Learn the best ways to design with ...

Mentor Graphics Corp. and Taipei, Taiwan-based fabless semiconductor provider Via Technologies Inc. today released the results of a collaborative effort to provide reference designs for use with ...

The other thing that I find PCB designers losing sleep over is: There are always sections of a design where you just can’t squeeze in ground vias at the interval that you would like. Since most ...

It also should be 0.062 in. thick with standard FR-4 and a copper foil weight of 1 oz. Additional layers, extra thick or thin boards, vias-in-pad, back-filled vias (non-conductive preferred due to ...

The PCB designer needs to make sure decoupling capacitor distance between the capacitor and the BGA ball is as short as possible, keeping signal distance between points A and B as short as possible.

Board thickness alters the size of the vias. To plate vias successfully, the aspect ratio needs to be about 10:1; if the board is 2mm thick, you can plate 0.2mm diameter vias. But the IPC ...

Tools that support collaborative design, such as cloud-based PCB design software, further enhance this streamlined workflow by allowing real-time collaboration and updates. Enhanced Knowledge Sharing ...

Adaptive optimization algorithms promise better results and deeper insight into why certain designs perform better than ...

Generally speaking, thePCB technology dictates how narrow the traces can be, how closelyfeatures such as traces, pads, and vias can be placed, the minimumdiameter of the via holes, as well as if vias ...