SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...

According to Samsung: “To build a 3D TSV DRAM package, the DDR4 dies are ground down as thin as a few dozen micrometers, then pierced to contain hundreds of fine holes.

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology ...

Samsung today announced that they have developed an industry first in the new 12-layer 3D-TSV (Through Silicon Via) design. The design uses 60,000 TSV holes to enable the stacking of DRAM chips in ...

The focus will be on TSV-focus, wafer-pair geometry, edges, and equipment issues with BWP. Andy Rudack (SEMATECH) is the Task Force leader. Inspection and Metrology Task Force: With no existing ...

T. Fukushima, “Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE,” 2021 Symposium on VLSI Circuits, 2021, pp. 1-2, doi: 10.23919/VLSICircuits52068.2021.9492335. Abstract: “More ...

Featuring up to a three-fold improvement in wafer-to-wafer bond alignment accuracy as well as a 50 percent increase in throughput over the previous industry benchmark platform, the GEMINI FB XT clears ...

It succeeded in the world's first development of the bumpless TSV 3D technology, enabling wafer stack easily even thinned-down wafers. 3 Bumps: Joint metal material formed by electroplating method.

One common test need for TSV-based 3D ICs is for lowering the cost of probing fine-pitch microbumps.” One way to tackle this problem is to incorporate more self-testing features on the chip.

3D Through-Silicon Via or TSV, in contrast, passes the connector through the chips, as the name of the technology suggests. not only does it take up less space horizontally, it also reduces the ...

“Our industry has been talking about the promise of 3D chip stacking for years, but this development is another sign that the promise will soon be a reality,†said David McCann, vice president of ...