SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...

Several 3D packages, such as System in Package and Chip Stack MCM, are available in the market providing smaller form factor and greater connectivity. The stacked chips are wired together along their ...

Nanya Technology debuted prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D IC technology at a July 18 investors conference.

Toshiba announced development of the world’s first BiCS FLASH 3D flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology, allowing 1 ...