The xMEMS µCooling fan-on-a-chip platform claims the first in-frame active cooling for AI-powered wearables. xMEMS Labs, Inc.

SANTA CLARA, Calif., June 24, 2025--xMEMS Labs, Inc., inventor of the world’s first monolithic silicon MEMS air pump, today ...

Luke is checking out the SilentiumPC Fera 5 Dual - a fairly conventional air cooler, but one that costs just £29.99. Luke is honestly quite astounded by the performance and quality on offer for that ...

xMEMS Labs, the company behind the world’s first monolithic silicon MEMS air pump, has expanded its µCooling fan-on-a-chip platform into XR smart glasses, providing the first in-frame active cooling ...

The new air cooler still has wide compatibility, supporting multiple socket generations from Intel and AMD. It works with LGA115X, LGA1200, LGA1700, and the just-launched LGA1851.

Alloy launched a direct liquid cooling (DLC) copper solution that aims to slash AI data center energy costs and eliminate the ...

TAIPEI, Taiwan--(BUSINESS WIRE)--Ventiva ®, the leader in thermal solutions, today announced it will demonstrate its latest air-cooling innovation at Computex 2025: a 45W TDP (thermal design ...

Ventiva to Showcase Fan-less Cooling Solution for Compal PCs Up to 45W TDP at Computex 2025. Ventiva®, the leader in thermal solutions, today announced its ICE9™ thermal management system is ...

Ventiva®, the leader in thermal solutions, today announced it will demonstrate its latest air-cooling innovation at Computex 2025: a 45W TDP (thermal design power) reference design suitable for ...

The 45W TDP (thermal design power) ... Ventiva to Showcase Fan-less Cooling Solution for Compal PCs Up to 45W TDP at Computex 2025. Business Wire . Sun, May 18, 2025, 7:10 PM 3 min read.