System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

“System-on-chip [SOC] technologies present a disadvantage in terms of development cost and memory capacity, while conventional SiP products have larger package sizes due to thicker interposers, and ...

System in Package (SiP) technology is a packaging solution that integrates multiple components, such as microprocessors, memory chips, sensors, and other functionalities, into a single chip package.

The board uses the companies’ SuperGaN® System-in-Package (SiP)—the WT7162RHUG24A —to achieve 92.7 percent efficiency in a Quasi-Resonant Flyback (QRF) topology.

Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood ...

Broadcom has just announced its new 3.5D eXtreme Dimension System in Package (XDSiP) platform technology, which enables consumer AI customers to develop next-generation custom accelerators (XPUs).

One remarkable aspect of the board is the Raspberry-designed RP3A0 system-in-package, which includes the four CPUs and 512 MB of RAM all on the same chip. While 512 MB of memory is not extravagant ...

Weltrend announced its first GaN-based system-in-package integrating an AC/DC controller and Transphorm’s 240-mΩ, 650-V SuperGaN FET. The WT7162RHUG24A is intended for USB Type- C Power Delivery (PD) ...