CHANDLER, Ariz.– Amkor Technology Inc. here today announced it will offer faster turnaround times for assembled chips in quad flat no-lead (QFN) packages as a result of a new saw-singulated process, ...

“Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a ...