They begin by covering a silicon wafer with a layer of silicon dioxide and etching in arrowhead-shaped trenches (“like a field plowed prior to planting” as IEEE Spectrum describes it).
A new technical paper titled “Sputtered L1 0-FePd and its Synthetic Antiferromagnet on Si/SiO2 Wafers for Scalable Spintronics” was published by researchers at University of Minnesota and NIST, with ...