The SoP design integrates an RF chip onto a 2.66-inch e-paper display glass substrate using Realtek Semiconductor's next-generation Redistribution Layer (RDL) technology, ...

IC Potash Corp. -- Sidney Himmel, President and Chief Executive Officer of IC Potash Corp. , announced today the successful conclusion of an independent feasibility study for its 100%-owned ...

E Ink, the leading company in electronic paper technology, has joined forces with Realtek Semiconductor to introduce a next-generation System on Panel (SoP) design for electronic shelf labels (ESL).

Targeting portable products, the devices come in a SOP-8 package. Staff. Rated at 30V and 8A (FY8AAJ-03F), 10A (FY10AAJ-03F), 12A ... and become an exclusive member of Electronic Design, ...

Three new ultra-high speed logic devices have been added to the company's ECL Pro logic family—the ever-expanding ECL Pro logic family is said to offer an easy upgrade path from ...

BILLERICA, Mass., March 21, 2025 (GLOBE NEWSWIRE) -- E Ink (8069.TW) the originator, pioneer, and global commercial leader in electronic paper (ePaper) technology, today announced its collaboration ...

Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results Wednesday Feb. 19, 2025 RaiderChip NPU for ...

KARACHI: Government of Sindh with 100 percent grant in aid of Asian Infrastructure Investment Bank (AIIB) will carry out environmental, social safeguards and design studies to prepare sub-project ...

Next-Gen SoP Technology Redefines Electronic Shelf Labels with Slimmer Borders and Enhanced Efficiency Next-Gen SoP ESL Comparison Next-Gen SoP Technology Redefines Electronic Shelf Labels with ...