A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by Advanced Interconnect Technologies (AIT) meets... High-reliability packages, always in demand within the ...

and its new M5 chip with SoIC advanced packaging (SoIC = Small Outline Integrated Circuit) from TSMC. The new SoIC advanced packaging allows for chips to be 3D-stacked, which provides improved ...

[Pyra] was looking for a way to reprogram some ATtiny13 microcontrollers in a SOIC package. He’s re-engineering some consumer electronics so adding an ISP header to the design isn’t an option.

Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for silicon that can power consumer Macs and ...

With some clever thinking, [Simon Merrett] has found a way to re-use something many of us already have — an SOIC-8 test clip — to connect to a special footprint on the PCB without requiring ...

As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you. TSMC chairman Mark Liu and TSMC chief ...

Despite this, the M5 will feature significant advancements over the M4, notably through the adoption of TSMC's System on Integrated Chip (SoIC) technology. This 3D chip-stacking approach enhances ...

Simultaneously, the foundry's production capacity for 3D-stacked system-on-integrated chips (SoIC) packaging is set to undergo a significant... Save my User ID and Password Some subscribers prefer ...

Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip (SoIC) technologies focused by AP6 can be flexibly... Save my User ID and Password Some ...