Cadence said the system chiplet integrates Arm’s processor IP with its system, memory, and interconnect IP and PHYs in a single die. It’s also one of the first chiplets to comply with Arm's ...

SAN DIEGO, July 24, 2024--Chiplet Summit announces its third annual event on January 21-23 at the Santa Clara Convention Center. The 2025 meeting focuses on a new level in chip design: system-in ...

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors.

To expedite this type of SiP analysis, the required chiplet models and performance data should be included in their respective design kits. Test Planning and Validation Perhaps one of the more ...

Key highlights: UCIe Consortium continues to advance an open chiplet ecosystem by releasing the latest specification supporting 3D packaging, manageability system architecture, and more.

A key focus is improving manageability and testing for multi-chip system-in-package (SIP) designs. UCIe 2.0 adds an optional "DFx Architecture" that essentially bakes management fabric into each ...

SiP design “The new design kits, developed through collaboration between OCP and JEDEC, promote innovation in SiP design by fostering collaboration and openness, ensuring broad accessibility, and ...

AUSTIN, Texas, Feb. 27, 2025 /PRNewswire/ -- Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State Technology ...

While chiplets have been around for decades, today they are the hottest trend in chip making powering millions of devices from PCs, to servers, phones and wearables.

D&R provides a directory of chiplet-based designs VLSI. Audio codec with capacitor-less 106 dB dynamic range ADC and 120 dB SNR DAC with low latency ...