RFIC can be delivered in three variants: 6x6mm QFN40 or 5x5mm QFN32 packages, or unpackaged, in dies for SiP implementation. IC is fabricated on SMIC CMOS 0.18 um technology.

This IP is used to connect a digital RFIC to RF front end components, like Power Amplifiers (PA), Low-Noise Amplifiers (LNA), filters, switches, power management modules, Antenna Turner and Sensors, ...