[Redherring32] wasn’t one to be stopped by this, however, and turned these DIP chips into QFN-style-mounted dies (Nitter) using little more than a Dremel cutting wheel. Why? To bring his ...

Decca is backed by Qualcomm, Infineon and ASE Group ... focused on the production of sophisticated ASICs in QFN packages. In September last year, RRP Electronics inaugurated a facility equipped ...

Deca Technologies, a leader in advanced semiconductor packaging with backing from industry giants like Qualcomm, Infineon ... Integrated Circuits (ASICs) in QFN packages. This further cements ...