One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand for power ...

Key Enhancements The next-generation preamplifier circuits, now housed in a compact 2 mm by 2 mm by 0.76 mm QFN package ... By investing in proprietary IC technology and offering adaptable ...

After removing the VL805 QFN package and soldering in the bridge ... As a bonus, [Zak] also found that despite the removal of the VL805 IC from the Raspberry Pi rendering its USB 3 ports useless ...

That’s because the low-impedance connections between the die and the package pins provide a path for heat to conduct out of IC pins. Furthermore, by employing standard QFN package technology ...

Looking at the 0603 SMD resistor values for given output voltages provides the programming resistances, combined with the footprint of the QFN-20 package. After desoldering the IC on a sample ...

Housed in a 4-mm × 4-mm QFN, the TPS6211x achieves high efficiency over a wide load current range by entering a power-saving pulse-frequency modulation (PFM) mode at light load currents.

Power is required at 3.3 or 5V, and the chip comes in a 5 x 5mm 32pin QFN, and something similar in a 20pin TSSOP is planned. See the interface IC at Embedded World in Nuremberg over 11-13 March on ...