“Die cost reduction has been enabled so far by concurrent scaling of poly pitch, metal pitch, and cell height scaling. This [will likely] continue until 2024,” according to one of nine white papers ...

At this week’s IEEE IEDM 2018 conference, imec, the Leuven-based research and innovation hub has presented a first demonstration of 3D stacked FinFETs on 300mm wafers using a sequential integration ...