After 90 minutes, he polished the board again and separated the vias to prepare for the real test: solder. This time, every hole except the smallest size reported a resistance of 0.1 Ω.

Rather than using numerous through-holes in a multi-layer PCB, designers have found that using blind and buried vias can tremendously increase routing density. Learn the best ways to design with ...

Mentor Graphics Corp. and Taipei, Taiwan-based fabless semiconductor provider Via Technologies Inc. today released the results of a collaborative effort to provide reference designs for use with ...