The modular VIP platform provides designers with ... ready-to-use design platform. Lattice’s new USB3-GigE VIP IO Board enables Ethernet connections at gigabit speeds and USB 3.0 connectivity ...

Their modular lattice design, formed by metal centers and conjugated ligands, allows exceptional control over electronic states, enabling applications in quantum transport and superconductivity.

Made available to developers last week, and the subject of today's Project Ara Modular Developers Conference, the Module Developers Kit (MDK) incorporates Lattice FPGAs for critical connectivity ...

Lattice’s CrossLink™ portfolio encompasses seven new modular IP cores for increased flexibility in video bridging capabilities across consumer, industrial and automotive applications Expanded ...

Made available to developers last week, and the subject of today’s Project Ara Modular Developers Conference, the Module Developers Kit (MDK) incorporates Lattice FPGAs for critical connectivity ...

PORTLAND, OR, Aug. 29, 2017 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, announces the availability of seven new modular IP ...